Using self-developed amorphous silicon sensors and digital measurement bridge circuit, image element size 17um, with high structural reliability, good consistency, high detection sensitivity, low power consumption, etc., applied to security, monitoring, car auxiliary, cell phones, smart home and other fields.
640x512 array size
17 μ Pixel size of m
Maximum frame rate 60Hz
NETD ≤ 50mK (F/1, 300K, 30Hz)
Thermal time constant 8-10ms
3.6V/1.8V power supply
Low power consumption<150mW
Fully digital interface, no need for off chip DAC/ADC
Operability rate>99.5%
Built in 14 bit column ADC
Support applications without TEC or blocking
Working temperature range -40 ° C to+65 ° C
36PIN PGA ceramic packaging
Package size 24x24x3.9m
High structural reliability: the amorphous silicon sensor adopts a thermo-symmetric micro-bridge structure with independent intellectual property rights, which is structurally stable and can be used in environments with high requirements for mechanical strength.
Good performance consistency: The detector adopts amorphous silicon as the heat-sensitive material, with low difficulty and good consistency in the thin film process, which can effectively ensure the non-uniformity of the product.
High detection sensitivity: The detector adopts full-bridge measurement circuit and thermo-symmetric micro-bridge structure, realizing NETD≤50mK and thermal response time less than 10ms.
Fine image: It can provide high-speed and fine infrared image to meet the application requirements of large field of view.
Low power consumption: the detector adopts all-digital measurement circuit, low power consumption.
Industrial temperature measurement
Security monitoring
Fire rescue
Car mounted night vision
Building inspection
Medical health
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